🎁 Final Month Special: 15% OFF + Free Shipping on Most Items! Don't Miss Out - Shop Now! ✨

Shopping Cart

Sub Total: $0.00
Total: $0.00
Checkout

Search Products

Thermal Paste Arctic TP-3 ThermalPAD 120x120x0.5mm Image 1
View Media Gallery
Thermal Paste Arctic TP-3 ThermalPAD 120x120x0.5mm Image 2
View Media Gallery
Thermal Paste Arctic TP-3 ThermalPAD 120x120x0.5mm Nav Image 1
Thermal Paste Arctic TP-3 ThermalPAD 120x120x0.5mm Nav Image 2

Thermal Paste Arctic TP-3 ThermalPAD 120x120x0.5mm

$849.00 $999.00


Tags:

IT NEW


Categories:

Component
Estimated Delivery:
0 people are viewing this right now
Guaranteed Safe Checkout
Trust
Trust
  • Description

High Performance - Very Soft Based on silicone and a special filler material, TP-3 outperforms high-performance pads, especially when height differences of closely spaced chips usually occur due to manufacturing tolerances. TP-3 offers excellent thermal conductivity despite its extremely low hardness. Minimizing thermal resistance The thinner the pad, the lower the thermal resistance. The TP-3 pad with a thickness of 0.5 mm can be easily compressed to 0.3 mm and thus compensates for height differences between various components of up to 0.2 mm. Please note that due to the extremely low hardness, the placement of the 0.5 mm pad requires special care. Versatile applications Thermally conductive, shock-absorbing, moldable, electrically insulating - safe and easy to use. Thanks to its good compression properties, the soft thermal pad is particularly gentle on components and at the same time a good heat conductor. In addition to the standard form for M.2, the TP-3 is available in various sizes and thicknesses, which can be easily cut to the desired shape and size. This makes it ideal for RAMs, chipsets and integrated circuits of all kinds, which are used in computers, laptops, consoles, graphics cards and in general in electronic devices. Safe handling ARCTIC TP-3 is electrically insulating, non-adhesive and easy to handle. This means that optimal and safe heat transfer can be ensured in many application areas. Gap bridging TP-3 is softer than conventional pads and therefore particularly suitable for different chip heights. Thanks to their good compressibility properties, thermal pads act as the perfect gap filler and bridge uneven surface and air gaps without straining sensitive and protruding components. Available in different thicknesses and sizes Thermal pads are available in 0.5 mm, 1.0 mm and 1.5 mm options. The 0.5 mm variant is ideal as an alternative to thermally conductive aluminum foil. The pads are available in different dimensions, depending on their thickness. If required, the pads can also be cut independently to any size.